NAND MCP

A Multi-Chip Package (MCP) integrates various storage technologies and processes onto a single substrate through a unified design. This innovative chip-stacking technology optimizes circuit board design and conserves space. XSemitron Technology offers a range of storage solutions, including SLC NAND Flash and low-power LPDDR2/LPDDR4X mobile DRAM, all on a single substrate. This highly integrated design method provides several advantages:

• Enhanced storage performance and integration by stacking two storage modules together, establishing the shortest and most stable connections
• A reduction in the design area of the circuit board (CB) by 30%-40% compared to discrete device solutions
• Fewer components in the Bill of Materials (BOM), leading to lower costs for procurement, logistics, operations, and processing
• Accelerated product development, resulting in a shorter time to market

The XTX MCP product line features various storage configurations, primarily based on 2-die and 3-die stack packages. The most common combinations include 1Gb+1Gbit, 2Gb+1Gb, 2Gbit+2Gb, 4Gb+2Gb, and 4Gb+4Gb (NAND and low-power DRAM).

Whether you want to reduce power consumption, create more space on a PCB board, or expedite product development, XSemitron MCP products can meet your diverse application needs. Our efficient, high-performance MCPs are essential for mobile product designs.