XSemitron offers a variety of packaging options, including BGA24 (6x8mm), WSON8 (5x6mm), DFN82 (2x3mm), DFN6 (1.2x1.2mm), and wafer-level CSP. This diverse selection of small packages is designed to meet the needs of various Internet of Things (IoT) applications, such as TDDI/AMOLED for screen displays, CAT1/CAT4/NB-IoT for wireless connectivity, and other highly integrated modular solutions. These options align with the trends in numerous products.

We provide low standby power consumption with memory options ranging from 1Mbit to 128Mbit and a wide voltage range from 1.65V to 3.6V for SPl NOR. This addresses the requirements for compact size and low power consumption in portable and wearable devices. Our one-stop solution ensures timely delivery and cost efficiency.